Micro­power

  

Volume 2 · Number 1 · February 1982

Page 20 of 37

Fig.     2 A Suitable Vero Board Layout


NOTES: 1) The layout is shown from the copper side. All components except the links and 2 diodes noted below are mounted on the other side of the board
2) If zero insertion force sockets are used mount all links near them first as they will cover the holes
3) X signifies a track cut through, • is a soldered connection, lines shown as •——————• are tinned copper links, three of which are tapped part way along their length (b, c and d)
4) Decoupling capacitors are not shown, but 0.01 to 0.1 µf are recommended (1 per ic)
5) The following insulated wire links, mounted on the copper side of the board, are not shown:
IC1 pin 15 to 10kOhm aIC3 pin 9 to 2708 pin 8
TR5 coll. to 2716 pin 20IC3 pin 13 to 2708 pin 1
IC3 pin 15 to 2716 pin 19
Connect the 2708 pins 1,4,5,6,7,8,9, 10, 11, 22 & 23 to the corresponding pins on the 2716 socket
6) A 1N4148 diode is connected from +5v to pin 21, 2716 (cathode to pin21) and another 1n4148 from pin 21, 2716 to pin 18, 2708 (cathode to pin 21)
Page 20 of 37